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features description/ordering information sn54abt541, sn74abt541b octal buffers/drivers with 3-state outputs scbs093l ? december 1993 ? revised december 2006 state-of-the-art epic-iib? bicmos design significantly reduces power dissipation latch-up performance exceeds 500 ma per jedec standard jesd-17 typical v olp (output ground bounce) < 1 v at v cc = 5 v, t a = 25 c high-impedance state during power up and power down high-drive outputs (?32-ma i oh , 64-ma i ol ) package options include plastic small-outline (dw), shrink small-outline (db), and thin shrink small-outline (pw) packages, ceramic chip carriers (fk), ceramic flat (w) package, and plastic (n) and ceramic (j) dips the sn54abt541 and sn74abt541b octal buffers and line drivers are ideal for driving bus lines or buffering memory address registers. the devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout. ordering information t a package (1) orderable part number top-side marking pdip ? n reel of 1000 sn74abt541bn sn74abt541bn tube of 25 sn74abt541bdw soic ? dw abt541b reel of 2000 sn74abt541bdwr ?40 c to 85 c sn74abt541bdbr ssop ? db reel of 2000 ab541b sn74abt541bdbrg4 reel of 1050 sn74abt541bpw tssop ? pw ab541b reel of 2000 sn74abt541bpwr cdip ? j reel of 1000 snj54abt541j snj54abt541j ?55 c to 125 c cfp ? w reel of 510 snj54abt541w snj54abt541w lccc ? fk reel of 2200 snj54abt541fk snj54abt541fk (1) package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. epic-iib is a trademark of texas instruments. production data information is current as of publication date. copyright ? 1993?2006, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. www.ti.com sn54abt541...j or w package sn74abt541b...db, dw, n, or pw package (top view) oe1 v cc 1 20 a1 oe2 2 19 a2 y1 3 18 a3 y2 4 17 a4 y3 5 16 a5 y4 6 15 a6 y5 7 14 a7 y6 8 13 a8 y7 9 12 gnd y8 10 11 sn54abt541...fk package (top view) a3 4 a4 5 a5 6 a6 7 y1 18 y2 17 y3 16 y4 15 y5 14 a7 8 1 20 2 19 oe1 v cc a1 oe2 a2 3 y6 13 a8 y7 9 12 gnd y8 10 11
description/ordering information (continued) sn54abt541, sn74abt541b octal buffers/drivers with 3-state outputs scbs093l ? december 1993 ? revised december 2006 the 3-state control gate is a two-input and gate with active-low inputs so that if either output-enable ( oe1 or oe2) input is high, all eight outputs are in the high-impedance state. when vcc is between 0 and 2.1 v, the device is in the high-impedance state during power up or power down. however, to ensure the high-impedance state above 2.1 v, oe should be tied to vcc through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. the sn54abt541 is characterized for operation over the full military temperature range of ?55 c to 125 c. the sn74abt541b is characterized for operation from ?40 c to 85 c. function table inputs outputs y oe1 oe2 a l l l l l l h h h x x z x h x z logic symbol (1) logic diagram (positive logic) (1) this symbol is in accordance with ansi/ieee std 91-1984 and iec publication 617-12. 2 submit documentation feedback www.ti.com oe1 o 2 e a1 y1 to seven other channels 1 19 18 2 oe1 oe2 a1 1 y1 18 a2 2 y2 17 a3 3 y3 16 a4 4 y4 15 a5 5 y5 14 a6 6 y6 13 a7 7 y7 12 a8 89 19 y8 11 1 & en
absolute maximum ratings (1) recommended operating conditions (1) sn54abt541, sn74abt541b octal buffers/drivers with 3-state outputs scbs093l ? december 1993 ? revised december 2006 over recommended operating free-air temperature range (unless otherwise noted) min max unit v cc supply voltage range ?0.5 7 v v i input voltage range (2) ?0.5 7 v v o voltage range applied to any output in the high or power-off state ?0.5 5.5 v i o current into any output in the low state sn54abt541 96 ma sn74abt541b 128 i ik input clamp current v i < 0 ?18 ma i ok output clamp current v o < 0 ?50 ma q ja package thermal impedance (3) db package 115 dw package 97 c/w n package 67 pw package 128 t stg storage temperature range ?65 150 c (1) stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditions? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) the input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (3) the package thermal impedance is calculated in accordance with jesd 51, except for through-hole packages, which use a trace length of zero. over recommended operating free-air temperature range (unless otherwise noted) sn54abt541 sn74abt541b unit min max min max v cc supply voltage 4.5 5.5 4.5 5.5 v v ih high-level input voltage 2 2 v v il low-level input voltage 0.8 0.8 v i oh high-level output current ?24 ?32 ma i ol low-level output current 48 64 ma d t/ d v input transition rise or fall rate 5 5 ns/v d t/ d v cc power-up ramp rate 200 m s/v t a operating free-air temperature ?55 125 ?40 85 c (1) all unused inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs, literature number scba004. 3 submit documentation feedback www.ti.com
electrical characteristics sn54abt541, sn74abt541b octal buffers/drivers with 3-state outputs scbs093l ? december 1993 ? revised december 2006 over operating free-air temperature range (unless otherwise noted) t a = 25 c sn54abt51 sn74abt541b parameter test conditions unit min typ (1) max min max min max v ik v cc = 4.5 v, i i = ?18 ma ?1.2 ?1.2 ?1.2 v v oh v cc = 4.5 v, i oh = ?3 ma 2.5 2.5 2.5 v cc = 5 v, i oh = ?3 ma 3 3 3 v v cc = 4.5 v, i oh = ?24 ma 2 2 i oh = ?32 ma 2 (2) 2 v ol v cc = 4.5 v, i ol = 48 ma 0.55 0.55 vv i ol = 64 ma 0.55 (2) 0.55 v hys 100 mv i i v cc = 5.5 v, v i = v cc or gnd 1 1 1 m a i ozpu v cc = 0 to 2.1 v, v o = 0.5 v to 2.7 v, oe = x 50 (3) 50 (3) 50 m a i ozpd v cc = 2.1 v to 0, v o = 0.5 v to 2.7 v, oe = x 50 (3) 50 (3) 50 m a i ozh v cc = 5.5 v, v o = 2.7 v 10 10 10 m a i ozl v cc = 5.5 v, v o = 0.5 v ?10 ?10 ?10 m a i off v cc = 0 v, v i or v o 4.5 v 100 100 m a i cex v cc = 5.5 v, v o = 5.5 v, outputs high 50 50 m a i o v cc = 5.5 v (4) , v o = 2.5 v ?50 ?140 ?180 ?50 ?180 ?50 ?180 ma i cc v cc = 5.5 v, outputs high 5 250 250 250 m a i o = 0 v, outputs low 22 30 30 30 ma v i = v cc or gnd outputs disabled 1 250 250 250 m a d i cc v cc = 5.5 v, outputs enabled 1.5 1.5 1.5 ma one input at 3.4 v, outputs disabled 50 50 50 m a other inputs at v cc or control inputs 1.5 1.2 1.5 ma gnd (5) c i v i = 2.5 v or 0.5 v 3 pf c o v o = 2.5 v or 0.5 v 6 pf (1) all typical values are at v cc = 5 v. (2) on products compliant to mil-prf-38535, this parameter does not apply. (3) on products compliant to mil-prf-38535, this parameter is not production tested. (4) not more than one output should be tested at a time, and the duration of the test should not exceed one second. (5) this is the increase in supply current for each input that is at the specified ttl voltage level rather than v cc or gnd. 4 submit documentation feedback www.ti.com
switching characteristics, sn54abt541 switching characteristics, sn74abt541b sn54abt541, sn74abt541b octal buffers/drivers with 3-state outputs scbs093l ? december 1993 ? revised december 2006 over recommended ranges of supply voltage and operating free-air temperature, c l = 50 pf (unless otherwise noted) (see figure 1 ) vcc = 5 v, from to ta = 25 c parameter unit (input) (output) min typ max min max t plh 1 2.6 4.1 1 4.6 a y ns t phl 1 2.9 4.2 1 4.7 t pzh 1.1 3.1 4.8 1.1 5.4 oe y ns t pzl 2.1 4.4 5.9 2.1 7 t phz 2.1 5.1 6.6 2.1 7.5 oe y ns t plz 1.7 4.7 6.2 1.7 6.7 over recommended ranges of supply voltage and operating free-air temperature, c l = 50 pf (unless otherwise noted) (see figure 1 ) vcc = 5 v, from to ta = 25 c parameter unit (input) (output) min typ max min max t plh 1 2 3.2 1 3.9 a y ns t phl 1 2.6 3.5 1 3.9 t pzh 2 3.5 4.5 2 4 oe y ns t pzl 1.9 4 5.1 1.9 5.9 t phz 2.2 4.4 5.4 2.2 5.8 oe y ns t plz 1.5 3 4 1.5 4.4 t sk(o) (1) 0.5 0.5 ns (1) skew between any two outputs of the same package switching in the same direction. 5 submit documentation feedback www.ti.com
parameter measurment information sn54abt541, sn74abt541b octal buffers/drivers with 3-state outputs scbs093l ? december 1993 ? revised december 2006 figure 1. load circuit and voltage waveforms 6 submit documentation feedback www.ti.com t h t su datainput timinginput 0v0v 0v t w input 0v input output waveform1 s1at7v (seenoteb) output waveform2 s1atopen (seenoteb) v ol v oh 0v? 0v outputoutput output control 1.5v 1.5v 1.5v 1.5v 1.5v fromoutput undertest c =50pf (seenote a) l loadcircuit s1 7v open gnd 500 500 test s1 t /t plh phl open 7v t /t plz pzl open t /t phz pzh voltagewaveforms enable anddisabletimes low andhighlevel enabling voltagewaveforms propagationdelay times inverting andnoninvertingoutputs notes: a. c includesprobeandjigcapacitance. b. waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol. waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol. c. allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:prr 10mhz,z =50 ,t . d. theoutputsaremeasuredoneatatime,withonetransitionpermeasurement. l o r 2.5ns, t 2.5ns f voltagewaveforms pulseduration voltagewaveforms setup andholdtimes 3v3v 3v 1.5vv m 3.5v t pzl t plz t phz t pzh v C 0.3v oh v +0.3v ol 1.5v 1.5v 1.5v 1.5v v ol v oh 3v 3vv oh v ol 1.5v 1.5v v m 1.5v t plh t phl t plh t phl
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 5962-9471801q2a active lccc fk 20 1 tbd post-plate n / a for pkg type 5962-9471801qra active cdip j 20 1 tbd a42 snpb n / a for pkg type 5962-9471801qsa active cfp w 20 1 tbd a42 n / a for pkg type sn74abt541bdble obsolete ssop db 20 tbd call ti call ti sn74abt541bdbr active ssop db 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74abt541bdbre4 active ssop db 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74abt541bdbrg4 active ssop db 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74abt541bdw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74abt541bdwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74abt541bdwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74abt541bdwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74abt541bn active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type sn74abt541bne4 active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type sn74abt541bnsr active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74abt541bnsre4 active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74abt541bpw active tssop pw 20 70 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74abt541bpwe4 active tssop pw 20 70 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74abt541bpwle obsolete tssop pw 20 tbd call ti call ti sn74abt541bpwr active tssop pw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74ABT541BPWRE4 active tssop pw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim snj54abt541fk active lccc fk 20 1 tbd post-plate n / a for pkg type snj54abt541j active cdip j 20 1 tbd a42 snpb n / a for pkg type snj54abt541w active cfp w 20 1 tbd a42 n / a for pkg type (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. package option addendum www.ti.com 30-oct-2006 addendum-page 1
pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 30-oct-2006 addendum-page 2
tape and reel information package materials information www.ti.com 26-apr-2007 pack materials-page 1
device package pins site reel diameter (mm) reel width (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74abt541bdbr db 20 mla 330 16 8.2 7.5 2.5 12 16 q1 sn74abt541bdwr dw 20 mla 330 24 10.8 13.0 2.7 12 24 q1 sn74abt541bnsr ns 20 mla 330 24 8.2 13.0 2.5 12 24 q1 sn74abt541bpwr pw 20 mla 330 16 6.95 7.1 1.6 8 16 q1 tape and reel box information device package pins site length (mm) width (mm) height (mm) sn74abt541bdbr db 20 mla 333.2 333.2 28.58 sn74abt541bdwr dw 20 mla 333.2 333.2 31.75 sn74abt541bnsr ns 20 mla 333.2 333.2 31.75 sn74abt541bpwr pw 20 mla 333.2 333.2 28.58 package materials information www.ti.com 26-apr-2007 pack materials-page 2
package materials information www.ti.com 26-apr-2007 pack materials-page 3

mechanical data mlcc006b october 1996 post office box 655303 ? dallas, texas 75265 fk (s-cqcc-n**) leadless ceramic chip carrier 4040140 / d 10/96 28 terminal shown b 0.358 (9,09) max (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) a no. of min max 0.358 0.660 0.761 0.458 0.342 (8,69) min (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32) (18,78) ** 20 28 52 44 68 84 0.020 (0,51) terminals 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 12 13 14 15 16 18 17 11 10 8 9 7 5 4 3 2 0.020 (0,51) 0.010 (0,25) 6 1 28 26 27 19 21 b sq a sq 22 23 24 25 20 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. this package can be hermetically sealed with a metal lid. d. the terminals are gold plated. e. falls within jedec ms-004

mechanical data msso002e ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 db (r-pdso-g**) plastic small-outline 4040065 /e 12/01 28 pins shown gage plane 8,20 7,40 0,55 0,95 0,25 38 12,90 12,30 28 10,50 24 8,50 seating plane 9,90 7,90 30 10,50 9,90 0,38 5,60 5,00 15 0,22 14 a 28 1 20 16 6,50 6,50 14 0,05 min 5,90 5,90 dim a max a min pins ** 2,00 max 6,90 7,50 0,65 m 0,15 0 ? 8 0,10 0,09 0,25 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-150
mechanical data mtss001c january 1995 revised february 1999 post office box 655303 ? dallas, texas 75265 pw (r-pdso-g**) plastic small-outline package 14 pins shown 0,65 m 0,10 0,10 0,25 0,50 0,75 0,15 nom gage plane 28 9,80 9,60 24 7,90 7,70 20 16 6,60 6,40 4040064/f 01/97 0,30 6,60 6,20 8 0,19 4,30 4,50 7 0,15 14 a 1 1,20 max 14 5,10 4,90 8 3,10 2,90 a max a min dim pins ** 0,05 4,90 5,10 seating plane 0 8 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-153
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or "enhanced plastic." only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security low power www.ti.com/lpw telephony www.ti.com/telephony wireless video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2007, texas instruments incorporated

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